|About this Abstract
||2019 TMS Annual Meeting & Exhibition
||Solidification Processing of Light Metals and Alloys: An MPMD Symposium in Honor of David StJohn
||Directional Solidification to form Nanoscale Eutectic Microstructures in Al-Cu Thin Films
||Eli Sullivan, John A. Tomko, Patrick E. Hopkins, Jerrold A. Floro
|On-Site Speaker (Planned)
Eutectic lamellar structures offer the possibility to obtain nanoscale periodicity in thin films without lithography. To parallel the eutectic solidification science that is well established for bulk materials, we investigate the Al-Al2Cu system. Films, 50-1000 nm thick, were sputtered onto fused silica and directionally melted using a laser at different scan velocities. Interlamellar periods down to 50 nm were achieved with scan speeds of 5 cm/s. Our results agree with previous bulk studies, showing that the mechanisms for steady state lamellar growth are not dependent on film thickness, down to at least 200 nm. We will discuss ongoing investigations of hypoeutectic Al-Cu films, films down to 50 nm thick, and the effect of deliberately imposed perturbations on the eutectic structure. This work provides a basis for examining a wider range of eutectic thin film systems for a variety of applications where nanoscale interleaving can improve technical properties.