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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Author(s) Chao-hong Wang, Che-yang Lin
On-Site Speaker (Planned) Chao-hong Wang
Abstract Scope Co and its alloys are a promising diffusion barrier material due to superior electromigration resistance. Nevertheless, the rapid growth of the Co-Sn intermetallic compounds (IMCs) may degrade the reliability of solder joints. It was found that the microstructure of Co(P) and the IMC formation were greatly influenced by different contents of P. Minor amounts of sodium hypophosphite were added in the electroplating bath to adjust the P contents (from 0.5wt.%P to 3wt.%P) of the deposited Co(P) layer. In the solid-state Sn/Co-0.8wt.%P reactions, the IMC was mainly the CoSn<SUB>3</SUB>, mixed with a small amount of the metastable CoSn<SUB>4</SUB>. Remarkably, the IMC growth was greatly suppressed. In contrast, the growth rate in Sn/Co-3wt.%P/Cu was extremely fast. A series of interfacial reactions were systematically examined. Minor 0.8wt.%P doping was the optimal concentration to effectively suppress the IMC growth.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
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Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">Interfacial Reactions beInterfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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