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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
Author(s) YeonHo Son, Young Jun Pyo, Eric H Yoon, Seung-Boo Jung, Yongil Kim, Caroline Sunyong Lee
On-Site Speaker (Planned) Caroline Sunyong Lee
Abstract Scope Flexible substrate is widely used for various electronic devices. Since flexible substrate cannot withstand high temperature, light sintering system can be used for sintering flexible substrate. CNPs (Copper nano particles) with its size of 100 nm in diameter, were synthesized using polyol method, followed by dry 1-Octanethiol coating for oxidation prevention. Moreover, CVD method was used to convert PVP coated on the copper surface into graphene at 875 ℃. Nano-inks were fabricated by dispersing CNPs in 1-Octanol solvents. TEM image confirmed the coating of 1.2 nm-thick graphene coating and 10 nm-thick 1-Octanethiol coating. Raman spectra confirmed the conversion of PVP coating into graphene. The oxidation of Cu pattern was prevented for more than 240 days. After light sintering at 1400V, 1ms for 3 cycles, the resistivity was measured to be 2.90 x 10-7 Ω•m. Therefore, light sintering was shown to be the promising method for patterning on flexible substrate.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device

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