|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Thermodynamic Applications, Optimizations and Simulations in High-Temperature Processes: An EPD Symposium in Honor of Christopher W. Bale's 70th Birthday
||Exergy Analysis of Electronic Waste Processing through Secondary Copper Recycling
||Maryam Ghodrat, M Akbar Rhamdhani, Geoffrey Brooks, Markus Reuter
|On-Site Speaker (Planned)
In the present study, the printed circuit boards scrap of laptops; computers and mobile phones were targeted in order to recycle the metallic components. Ineffective recycling options leave a gap in the resource recovery. Closure of the cycle in a sustainable manner requires quantification of the effect of recycling processes on the degree of metallic materials recovery out of waste PCBs; for this purpose exergy analysis is used. This tool incorporates changes in both mass and quality of materials during recycling. Exergy analysis requires thermodynamical knowledge about the physical and chemical interaction between different metallic materials, flux, slag and oxygen during melting and their effects on the products. FactSage and HSC Chemistry thermochemical packages were used to model the process and quantify the exergy. The distribution of the elements in the various streams was predicted from the equilibrium calculations. The process flowsheet including mass and energy balance was then developed.
||Planned: TMS Journal: Metallurgical and Materials Transactions