|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Effects of Pretreatments on the Adhesion of Cu/Non-conductive Substrates in Electroless Copper Plating
||Ju-Seok Kang, Jinuk Lee, Hyun-Woo Kwon, Jae-Ho Lee
|On-Site Speaker (Planned)
Electroless copper plating has been used extensively in PCB industries. The processes were well known and established. In the normal process, the PCB substrates were chemically etched before electroless copper plating for the better adhesion between copper/substrate. The elecroless copper layers under DFR were etched out after copper line fabrication in PCB. In this procedure the electroless copper layers were over etched to remove the copper completely on the etched surface. During this procedure, the copper lines were also attacked and partially etched out, and then the credibility of line width was not guaranteed especially in narrow line/space. In this research, the electroless copper plating on the substrates without chemical etching was studied. The effects of pretreatments on the Pd seedings were investigated. Ultrasonic was used to enhance the adhesion of copper on the non-conductive substrates.
||Planned: Supplemental Proceedings volume