|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Pan American Materials Congress: Nanocrystalline and Ultra-fine Grain Materials and Bulk Metallic Glasses
||Comparisons of Mechanical Property Development during HPT Processing and Subsequent Room Temperature Storage in High Purity Cu and a Pb-62%Sn Alloy
||Yi Huang, Shima Sabbaghianrad, Abdulla I. Almazrouee, Khaled J. Al-Fadhalah, Saleh N. Alhajeri, Nian Xian Zhang, Terence G. Langdon
|On-Site Speaker (Planned)
High purity Cu and a Pb-62% Sn alloy were both processed by high-pressure torsion (HPT) at room temperature. High purity Cu shows strain hardening behavior with refined grain structures during HPT processing. By contrast, the Pb-Sn alloy displays a strain weakening behavior where the hardness values after HPT processing are significantly lower than in the initial condition even though the grain size is reduced in HPT processing. After HPT processing, high purity Cu with lower numbers of rotations softens with the time of storage due to local recrystallization and abnormal grain growth whereas the Pb-Sn alloy hardens with the time of storage accompanied by grain growth. The low melting point of the Pb-Sn alloy plays a role in hardness increase with storage time even with a coarsened grain structure during room temperature storage.
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