|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Mechanical and Creep Behavior of Advanced Materials: A SMD Symposium Honoring Prof. K. Linga Murty
||Dynamic Behavior of a Nanocrystalline Cu-Ta Alloy
||Scott Turnage , Kris Darling, Mansa Rajagopalan, Chad Hornbuckle , Kiran Solanki
|On-Site Speaker (Planned)
This investigation analyzes the compressive high strain rate (10<SUP>3</SUP> to 10<SUP>4</SUP> s<SUP>-1</SUP>) mechanical behavior of a nanocrystalline (<100 nm mean grain size) Cu 10 at.% Ta alloy processed through ball milling followed by equal channel angular extrusion. High strain rate behavior is measured with a split Hopkinson pressure bar at temperatures ranging from 25 ˚C to 800 ˚C. For comparison, quasistatic tests (10<SUP>-3</SUP> s<SUP>-1</SUP>) are also reported for the same range of temperatures. Aberration corrected transmission electron microscopy (TEM) is performed to analyze the microstructure of the samples before and after testing. Results show the effects of both temperature and strain rate on flow stress. Microstructure and mechanical behavior data reveals that twin and grain growth as a result of increased temperature cause phonon drag to play a more significant role at lower strain rates.
||Planned: Stand-alone book in which only your symposium’s papers would appear (indicate title in comments section below)