ProgramMaster Logo
Conference Tools for 2018 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
Author(s) Hooman Sabarou, Vadym Drozd, Dehua Huang, Yu Zhong
On-Site Speaker (Planned) Hooman Sabarou
Abstract Scope A series of thermodynamic investigations has been conducted on Pb(Mg1/3Nb2/3)O3-xPbTiO3 (PMN-PT) single crystals to study the effect of phase transitions on piezoelectric properties of the system. The research discusses the transition between two piezoelectric rhombohedral and paraelectric cubic phases during heating and cooling with variation in oxygen partial pressure (P(O2)). Crystal structure changes have been investigated by thermal analyses, in-situ XRD at high temperatures, Raman spectroscopy at high temperatures under high and low P(O2). Piezoelectric properties of the single crystals have been analyzed by impedance measurement techniques. Based on the results, a new mechanism has been suggested to explain the leading role of metastable phases and retained structures in piezoelectric properties. The thermodynamic approach discusses how defect chemistry controls the phase transition in PMN-PT system and consequently leaves an impact on piezoelectric properties. The findings in the current research address the electrical fatigue phenomenon in PMN-PT system.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
Alloy Phase Stability under Electric Currents
Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">Interfacial Reactions beInterfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria and Thermodynamic Assessment of the Mo-Nb-Re Ternary System
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Sinter Joining and Wiring without Pressure Assist for GaN Power Device Interconnection
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

Questions about ProgramMaster? Contact programming@programmaster.org