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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Author(s) Bing An, Xinlin Xie, Mingzhi Gao
On-Site Speaker (Planned) Bing An
Abstract Scope A new method "ion implantation / electroplating" has been developed for the manufacture of super-thin flexible copper clad laminate. The ion implantation was employed firstly to deposit a metallic tie layer on the polymer films (e.g. PI), and the copper layer up to 1 to 12 microns was then grown on the tie layer by electroplating process. Both of ion implantation and electroplating were processed in a roll-to-roll manner, and the tie coat and the electroplated copper layer prepared were fine and uniformly, and attached tightly on the polymer films. The copper layer exhibited very fine copper grains of 100 nm approximately, leading to a higher performance over that of the traditional rolled annealed or electrodeposited copper foils. This FCCL prepared by additive manufacturing has very low ion migration ratio while exhibits robust behavior during various reliability tests, and is expected to be used in hybrid circuit, medical electronics etc.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device

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