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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Author(s) Bing An, Xinlin Xie, Mingzhi Gao
On-Site Speaker (Planned) Bing An
Abstract Scope A new method "ion implantation / electroplating" has been developed for the manufacture of super-thin flexible copper clad laminate. The ion implantation was employed firstly to deposit a metallic tie layer on the polymer films (e.g. PI), and the copper layer up to 1 to 12 microns was then grown on the tie layer by electroplating process. Both of ion implantation and electroplating were processed in a roll-to-roll manner, and the tie coat and the electroplated copper layer prepared were fine and uniformly, and attached tightly on the polymer films. The copper layer exhibited very fine copper grains of 100 nm approximately, leading to a higher performance over that of the traditional rolled annealed or electrodeposited copper foils. This FCCL prepared by additive manufacturing has very low ion migration ratio while exhibits robust behavior during various reliability tests, and is expected to be used in hybrid circuit, medical electronics etc.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials


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