|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Sintering of Nanoparticle-based Interconnections through Chemical and Photonic Means
||Jenn-Ming Song, Tsung-Yun Pai, Guo-Lung Huang, Sin-Yong Liang
|On-Site Speaker (Planned)
In order to obtain excellent electrical conductivity for nanoparticle deposits, the surfactants have to be removed and the particles should be well linked. This study develops low temperature fabrication of interconnections on polymeric substrates using Ag nano/submicron particles by means of chemical reduction and photonic sintering as well. The reductants for chemical reduction are ascorbic acid and formic acid solutions, while photonic sintering is performed under flash UV light and NIR (near-infrared) light. In addition to ligand desorption during reduction/sintering process as well as the kinetics of particle coalescence, the studying subjects also encompass the effects of residual surfactant/reductant and microstructural characteristics on the electrical resistivity and current stressing reliability. Considering the application for wearable electronics, the electrical performance of the sintered interconnections subject to bending fatigue will also be evaluated.
||Planned: Supplemental Proceedings volume