|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Alloys and Compounds for Thermoelectric and Solar Cell Applications V
||L-13: Contribution Percentages of Electromigration and Diffusion on Interfacial Reactions at Joints in Thermoelectric Modules
||Jing-wei Chen, Sinn-wen Chen, Yi-cheng Lin, Tao-chih Chang
|On-Site Speaker (Planned)
Thermoelectric modules have attracted very intensive research interests primarily due to their ability of enhancing energy usage efficiency by converting waste heat into electricity. Thermoelectric modules are usually composed of arrays of devices, and there are numerous joints in thermoelectric modules. Interfacial reactions at these joints are critical to the module’s reliability. Dissimilar materials are in contact at the joints, and the atoms diffuse at elevated temperatures as driven by chemical potential gradients. Besides diffusion, electromigration also contribute to atomic flux. The interfacial reactions of Sn-based solder joints at different temperatures and electric current densities are experimentally investigated. A one-dimensional mass transfer model was developed to describe the growth of the reaction phase layer. The contribution percentages of diffusion and electromigration upon interfacial reactions are examined. Since the electric current densities are relatively low and the working temperatures are relative high, the contribution of interfacial reactions are mostly from diffusion.
||Planned: Supplemental Proceedings volume