|About this Abstract
||2013 TMS Annual Meeting & Exhibition
||2013 and Beyond: Flexible Electronics
||Use of Compliant Materials in the Fabrication of a Flexible Utah Neural Interface Electrode Array
||Brian Baker, Rohit Sharma, Prashant Tathireddy, Loren Rieth, Florian Solzbacher
|On-Site Speaker (Planned)
The Utah Electrode Array (UEA) makes use of a glass layer to mechanically connect and electrically insulate 100 individual silicon microelectrodes. Better matching of the mechanical properties of microelectrode arrays to brain tissue may reduce the brain’s foreign body encapsulation response. This research replaces the traditional UEA glass electrode insulation material with flexible materials.
Polydimethylsiloxane (PDMS) is used to fill the regions between the microelectrodes in the UEA and serves as a flexible electrical insulation layer. A parylene encapsulation layer above and below the PDMS provides the mechanical connection between electrodes. Results show that the flexible UEA in this study is more than 1,700 times more flexible than the traditional UEA while maintaining similar electrical properties.