|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Role of Bi in Microstructural Evolution of Sn-Cu-Ni and Sn-Ag-Cu Solders and their Mechanical Performance
||Sergey Belyakov, Takatoshi Nishimura, Keith Sweatman, Tetsuya Akaiwa, Christopher Gourlay
|On-Site Speaker (Planned)
There has been substantial industrial and scientific interest in Bismuth-containing Pb-free solders as Bi additions have been demonstrated to generate advantages including: improved thermal cycling and shear impact performance; improved wetting; lowered melting temperature; reduced growth rate of interfacial Cu3Sn intermetallic etc. In this study we investigate the influence of Bi additions on microstructure evolution in Sn-Cu-Ni/Cu and Sn-Ag-Cu/Cu solders joints. The focus is on (i) the influence of Bi on solder microstructure stability during ageing and (ii) correlation between the evolving solder microstructure and its mechanical response in shear impact tests. Finally, the influence of Bi levels on BGA solder joints failure mechanisms will be discussed.
||Planned: Supplemental Proceedings volume