|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Multiscale Architectured Materials (MAM II): Tailoring Mechanical Incompatibility for Superior Properties
||Multi-scale Cu/Nb Nanocomposite Wires Processed by Severe Plastic Deformation for High Pulsed Magnets: Assessing Size and Architecture Effects on the Resistance to High Stress
||Ludovic Thilly, Florence Lecouturier, Jean Rony Medy, Patrick Villechaise, Pierre-Olivier Renault
|On-Site Speaker (Planned)
Cu/Nb high-strength and high-electrical conductivity nanocomposite wires are prepared by severe plastic deformation, applied with an Accumulative Drawing and Bundling process (ADB), for the windings of high pulsed magnets. The ADB process leads to a multi-scale Cu matrix containing up to N=85<SUP>4</SUP> (52.2 10<SUP>6</SUP>) continuous parallel Nb filaments with diameter down to few tens nanometers. After heavy strain, the Nb filaments exhibit a homogeneous microstructure with grain size below 100 nm. The Cu matrix presents a multi-scale microstructure with multi-modal grain size distribution from the micrometer to the nanometer range. The use of complementary characterization techniques at microscopic and macroscopic scales (EBSD, in-situ TEM tensile tests, in-situ tensile tests under neutrons or synchrotron beam) shed light on the individual roles of the microstructure and its multi-scale nature in the recorded extreme mechanical properties.
[Acta Mat, 57 (2009), p3157; Acta Mat, 58 (2010), p6504; Adv. Eng. Mat., 14-11 (2012), p998].