| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Liquid Phase Sintered Solders as Thermal Interface Materials for Conventional and High Temperature Electronic Applications |
| Author(s) |
Jia Liu, Paul Rottmann, Shouvik Dutta, Chelliah M Nagaraj, Praveen Kumar, Mukul Renavikar, Rishi Raj, Indranath Dutta |
| On-Site Speaker (Planned) |
Jia Liu |
| Abstract Scope |
Liquid phase sintering (LPS) is utilized to design novel composite solder microstructures for next generation thermal interface material (TIM) applications for high power density devices. Cu-In composites are explored for microelectronic applications (up to 125<SUP>o</SUP>C), while Cu-Bi is studied for high temperature power electronics applications (above 270<SUP>o</SUP>C). The new LPS solders constitute a majority high melting phase (HMP) in a matrix of a minority low melting phase (LMP), and proffers high conductivity in conjunction with high mechanical compliance. The Cu-In system is susceptible to the formation of interfacial intermetallics, the effects of which on the evolution of sintered density and properties is discussed. The Cu-Bi system is less thermally conductive, but is highly mechanically compliant above the melting point of Bi, making it very attractive as a ‘thermal grease’ TIM. The mechanical and thermal properties of LPS solder systems with and without LMP melting will be discussed in detail. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |