|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Zero Pressure Ag Sinter Joining for Low Temperature Interconnection
||Hao Zhang, Chuantong Cheng, Yohji Suzuki, Yasuyuki Akai, Hiroyuki Fujii, Katsuaki Suganuma
|On-Site Speaker (Planned)
Ag sinter joining with the hybrid Ag particles is one of the most promising interconnection methods for WBG devices. It provides excellent performance even processed at low temperature around 250 °C, low pressure less than 1 MPa and air atmosphere. In certain applications, further low temperature and Zero pressure are required. Here, a new Ag sinter paste with a solvent including CELTOL was examined for this purpose, which achieved a good printability to make Ag patterns with uniform thickness and sharp shape. The new Ag paste had realized a very low resistivity of 3 x 10-6 Ωcm and over 80 MPa shear strength sintered at 280 °C with very small pressure. Furthermore, zero pressure bonding can be performed at 200 °C. The bonding shear strength was beyond 30 MPa. This can be attributed to the slow evaporation and decomposition of the new solvent at suitable temperatures.
||Planned: Supplemental Proceedings volume