|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Solar Cell Silicon
||A Low-cost and Novel Strategy for Inverted Pyramid Arrays Texturing of DWS mc-Si Wafers
||Shaoyuan Li, Yuxin Zou, Fengshuo Xi, Wenhui Ma, Kuixian Wei
|On-Site Speaker (Planned)
The depressing texturation and stubborn directional saw marks on diamond wire sawing mc-Si wafers lead to severe limitations for the mass application of DWS technology in PV market. Herein, a simple and low-cost copper-assisted chemical etching method was presented to fabricate large-area and uniform inverted pyramid arrays on DWS mc-Si wafers. The results display that the textured morphology of silicon wafer were greatly influenced by various metal species. Compared with the silicon nanowires structure introduced by Ag-assisted etching, the large area inverted pyramid introduced by nano Cu-assisted etching can more perfectly balance antireflection and surface passivation. The resulting inverted pyramid structure is the most uniform and the average reflectivity of textured sample decrease from 41.8% to ~5% in the wavelength range of 300~1100 nm. The superior anti-reflection performance and excellent saw marks elimination ability show a huge potential application in high-efficiency solar cells based on DWS mc-Si wafers.