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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Author(s) Yi-Zhen Guo, Chu-Hsuan Wang, Yee-Wen Yen, Yu-Chun Li
On-Site Speaker (Planned) Chu-Hsuan Wang
Abstract Scope The Au/Sn/Ni/Cu multilayer structure is a common structure at the solder joint. The Au/Sn/Ni/Cu multilayer structure was prepared using electroplating Ni/Sn layers on the Cu substrate and was sandwiched with the Au foil. The solid/solid state reaction couple technique was applied to investigate the interfacial reactiosn in the Au/Sn/Ni/Cu multilayer couples at 150, 180 and 200 oC for various durations. The result indicated that the intermetallic compound (IMC) thickness was increased with the increase of the reaction temperature. The IMC evolution in the couple was not changed at different temperatures. When the reaction time was increased, the AuSn4 and AuSn2 phase was converted to the AuSn phase. The voids formed in the couple due to the volume shrinkage and these voids were decreased with the increase of the reaction temperature. The (Ni, Au)3Sn2 phase was formed at the Ni side. The Ni layer can efficiently prevent the Cu-Sn IMC formation.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
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Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">K-13: Interfacial ReactiK-13: Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
K-14: Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
K-15: The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria and Thermodynamic Assessment of the Mo-Nb-Re Ternary System
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Sinter Joining and Wiring without Pressure Assist for GaN Power Device Interconnection
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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