|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
||Yi-Zhen Guo, Chu-Hsuan Wang, Yee-Wen Yen, Yu-Chun Li
|On-Site Speaker (Planned)
The Au/Sn/Ni/Cu multilayer structure is a common structure at the solder joint. The Au/Sn/Ni/Cu multilayer structure was prepared using electroplating Ni/Sn layers on the Cu substrate and was sandwiched with the Au foil. The solid/solid state reaction couple technique was applied to investigate the interfacial reactiosn in the Au/Sn/Ni/Cu multilayer couples at 150, 180 and 200 oC for various durations. The result indicated that the intermetallic compound (IMC) thickness was increased with the increase of the reaction temperature. The IMC evolution in the couple was not changed at different temperatures. When the reaction time was increased, the AuSn4 and AuSn2 phase was converted to the AuSn phase. The voids formed in the couple due to the volume shrinkage and these voids were decreased with the increase of the reaction temperature. The (Ni, Au)3Sn2 phase was formed at the Ni side. The Ni layer can efficiently prevent the Cu-Sn IMC formation.
||Planned: Supplemental Proceedings volume