|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Transient Liquid Phase Processing of Sn-Cu Alloys for Soldering Applications
||Stuart McDonald, Syeda Mehreen, Flora Somidin, Arif Anuar Mohd Salleh, Kazuhiro Nogita
|On-Site Speaker (Planned)
In tin-rich Sn-Cu alloys with a copper concentration in excess of 7.6 wt%, solidification commences with the nucleation and growth of the Cu3Sn phase. The equilibrium phase diagram predicts that on further cooling this Cu3Sn will undergo a peritectic reaction with the remaining liquid to form Cu6Sn5. This research investigates this solidification sequence using real-time synchrotron X-ray analysis including the effect of ternary nickel additions. It was found that the extent of the peritectic reaction is highly dependent on the nickel concentration and the formation of Cu3Sn can be completely suppressed after a critical concentration is exceeded . The results of this study were used as the rationale to develop a high-temperature solder alloy for use in transient liquid phase (TLP) processing. The reaction sequence of the TLP alloy during reflow soldering on a copper substrate is described.
||Planned: Supplemental Proceedings volume