|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Electromigration Enhanced Intermetallic Growth and Damage Formation in Pb-free Solder Joints
||Paul Ho, Brook Huang-Lin Chao, Seung-Hyun Chae, Xuefeng Zhang
|On-Site Speaker (Planned)
EM enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints were analyzed taking into account Cu–Sn interdiffusion and current stressing effects. A new simulated annealing (SA) approach was developed to derive atomic diffusivities and effective charge numbers for this multi-phase multi-component system. A consistent set of parameters were obtained and used in a finite difference model to numerically solve the IMC growth kinetics and the result accurately correlated with the experiment. EM reliability test revealed that solder joint failure was caused by extensive void formation and subsequent crack propagation at the intermetallic interface. This damage formation mechanism was analyzed by considering vacancy transport under current stressing, then followed by a finite element analysis on the crack driving force induced by void formation. Implications on the structural reliability of the through-Si-via in 3D interconnects will be discussed.
||Planned: Supplemental Proceedings volume