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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Author(s) Shih-kang Lin, Che-yu Yeh, Hseng-ming Liao, Mei-jun Wang
On-Site Speaker (Planned) Shih-kang Lin
Abstract Scope Direct Cu-to-Cu interconnection is an important process for application in three-dimensional integrated circuit (3D IC) and wide band gap (WBG) devices in electronic packaging industry. Micro-bumping and transient liquid phase (TLP) bonding are relatively fast and cheap process in Cu-to-Cu interconnection. However, brittle intermetallic compounds (IMCs) usually form at bonding joints, resulting in poor performance on mechanical and electrical properties. Therefore, how to fabricate bonding joints with solid-solution interface instead of IMCs is worthy to investigate. Since Ga has low melting point and wide solubility in Cu and Ni fcc phase, we proposed a new process for fabricating solid-solution Cu-to-Cu joints using Ga-based pastes and Ni UBM. High-performance Cu-to-Cu joints on mechanical property, thermal stability, and electrical property are demonstrated. This approach gives a new idea for Cu-to-Cu interconnection, which can be a promising process for next-generation 3D IC and WBG devices packaging.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
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Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">Interfacial Reactions beInterfacial Reactions between Lead-free Solders and Cu-xZn Alloys
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Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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