|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Interactions between Electromigration and Thermal Fatigue of Pb-free Interconnects
||Yong Zuo, Limin Ma, Fu Guo
|On-Site Speaker (Planned)
Electromigration and thermal fatigue are widely recognized and understood due to the reliability concerns. However, if addressing failure mechanisms of a solder joint under service condition, we still need to be cautious because real solder joints are usually exposure to more complicated conditions with high current density, temperature excursion, and mechanical loading. Therefore, electromigration and thermal fatigue may co-exist on one solder joint. Electromigration causes microstructure changing progressively, eventually results in different mechanical response. Thus, it is reasonable to infer that there are interactions between electromigration and thermal fatigue. In this research, we are expected to examine the effects of current stressing on microstructure evolution from thermal fatigue in Sn-based solder joints by characterizing the orientations of Sn crystals. Interactions between electromigration and thermal fatigue will be analyzed and discussed. The experiments will be beneficial to reveal failure mechanisms of real solder joints.
||Planned: A print-only volume