|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Electroplated (111)-oriented Au Films in Au-Au Direct Bonding
||John Wu, Chih Chen
|On-Site Speaker (Planned)
Advancement in semiconductor technology gives rise to a need of higher functionality chips. To lower line pitch and chip size and solve certain brittle intermetallic compound issues when decreased to a small scale we turn to research direct bonding mechanics without solders. The current widely used material is copper, but in this study gold bonding is investigated due to its high bonding strength and anti-oxidation properties. We perform direct bonding with <111> preferred orientated gold films. After electroplating gold films onto samples two <111> preferred oriented gold films were then bonded together at 250°C in a 10-3 torr vacuum condition. Further measurements were done by x-ray diffraction (XRD) and an electron back-scattered diffraction (EBSD) system. Observations of the microstructures were carried out with focused ion beam (FIB). By observing the different microstructures we can develop a better understanding of the bonding mechanics of (111) preferred gold films.
||Planned: Supplemental Proceedings volume