|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effect of Sn Grain Orientation on Thermomigration in Sn2.3Ag Microbumps
||Yu-An Shen, Kai-Cheng Shie, Fan-Yi Ouyang, Chih Chen
|On-Site Speaker (Planned)
Thermomigration (TM) reliability of microbump is a critical concern in a 3DIC module. Due to the Sn anisotropic diffusivity, Atoms of under bump metallization (UBM) diffused very fast into a Sn solder as the c-axis of Sn is parallel to the direction of a thermal gradient. In particular, the number of Sn grains may be few in a microbump. However, the effect of Sn grain orientation on the TM reliability of microbump are not clear. In this study, Cu/Sn2.3Ag/Ni microbumps were examined by a TM test with a temperature difference between a hot end at 200 ℃ and a cold end at 100 ℃. The bump diameter and height are 30 μm and 15 μm respectively. The results show that the Cu UBMs of microbumps were consumed rapidly, and serious Cu-Sn IMC formations are observed as the c-axis is in a low angle to the direction of the thermal gradient.
||Planned: Supplemental Proceedings volume