|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||FF-6: Microstructural Evolution during Processing of Sintered Joints
||Govindarajan Muralidharan, Donovan Leonard, Chad Parish, Harry Meyer
|On-Site Speaker (Planned)
There is a significant need for next-generation, high-performance power electronic packages and systems employing wide band gap devices to operate at high temperatures in automotive and electric grid applications. Die attach joints (solders and others) used in such systems are anticipated to be subject to prolonged exposures at operating temperatures greater than 200oC and thermal cycling between ambient and operating temperatures. Sintered silver joints are currently being evaluated as an alternative to Pb-free solder joints. This study will highlight the effect of substrate and die metallization on the microstructural evolution in sintered silver joints. *Work sponsored by the U.S. Department of Energy, Office of Electricity Delivery and Energy Reliability.
||Planned: A print-only volume