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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Author(s) William Farmer, Kumar Ankit
On-Site Speaker (Planned) William Farmer
Abstract Scope With a continuous downscaling of integrated circuits, interconnects are subject to increasingly high current densities. However, a sufficiently large electric current density can impart momentum to the metal ions triggering atomic diffusion, known as electromigration (EM), leading to the generation of micro defects, for e.g. voids and hillocks and ultimately causing circuit failure. Preventive measures currently adopted to mitigate EM-induced damage are unreliable as they are typically framed based on limited insights provided by 2-D imaging of the microstructural degradation. Here, we adopt a 3-D phase-field approach to computationally investigate the EM-mediated failure mechanisms in polycrystalline interconnects. An extensive parametric study reveals different modes of failure, such as grain-boundary slitting, surface drift, and the mixed-mode, while the critical role of grain-boundary curvature-driven coarsening in instigating damage is analyzed. We anticipate that the insights gained from this study will provide guidance for mitigating EM damage in polycrystalline lines in the future
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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