|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Late News Posters
||PP-61: Simulation Study on Wettability of Sn–3.5Ag on the Inclined Cu Substrate
||lina zhang, Zhangfu Yuan, Bingsheng Xu
|On-Site Speaker (Planned)
Wetting properties is the research emphasis for structural analysis and thermal performance. Combined with experimental results, the numerical simulation of the spreading process of Sn–3.5Ag solder can supply some important parameters to systematically study the interaction mechanism between the Sn–3.5Ag and the Cu substrate. This study provided a finite element analysis method using Surface Evolver to describe the surface properties of molten droplets on substrates, and the simulation results agreed well with the experimental results.
When the heating temperature reached 490K, the Sn–3.5Ag solder would completely melt on the horizontal Cu substrate. Similar results are obtained by Surface Evolver simulation, which well verified the previous experimental results.
This paper simulates the hysteresis behavior of molten lead–free solder on inclined Cu substrate, which offers theoretical guidance and data support for the comprehensive study of the interface reaction and wetting mechanism between the solder and the substrate.