| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Pb-free Process Development for Microcircuit Package Assemblies – A University/Industry Design Project Collaboration |
| Author(s) |
Mike Powers, Jim Shackelford, Derek Fong, Zi Gwen Kwan, Tammy Leung, Kit-Ying Mak, Enrique Pedron, Raminderdeep Sidhu, Hong-Siang Wei |
| On-Site Speaker (Planned) |
Mike Powers |
| Abstract Scope |
A team of engineering students in the Department of Chemical Engineering and Materials Science at the University of California Davis collaborated on a design project investigation to develop a cost effective process for Pb-free solder assembly of hybrid microcircuit package assemblies employed in test and measurement instruments (a "real" materials design project). The students considered the required materials properties, as dictated by the component assembly design, and how the properties are affected by materials selection and the joining process. The team conducted solder joint strength, Au embrittlement and solder wetting experiments at UC Davis in order to evaluate the process design. The team also conducted process development, including furnace profiling and reliability testing, at Agilent facilities in Santa Rosa, California. Through applied research and testing the student team developed a reliable Pb-free process for solder assembly of the hybrid microcircuit package assembly project vehicle. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |