| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties |
| Author(s) |
Vivek Chidambaram, John Hald, Jesper Hattel |
| On-Site Speaker (Planned) |
Vivek Chidambaram |
| Abstract Scope |
High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders.
This work outlines the criteria for the evaluation of a new high-temperature lead-free solder material. Furthermore, a list of potential high-temperature lead-free solder alternatives has been proposed. The high-temperature stability of microstructures and mechanical properties of these potential candidate alloys have been extensively reported. Focus has also been given to the property of corrosion resistance. This paper presents the superior characteristics as well as some drawbacks of the various high-temperature lead-free solder alternatives. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |