|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Deformation and Transitions at Interfaces
||A Micro-Compression Test Study of Grain Boundary Sliding
||Jicheng Gong, Angus J. Wilkinson
|On-Site Speaker (Planned)
Grain boundary sliding is an important deformation mechanism that contributes to creep and superplastic forming. In tin-based lead-free solders grain boundary sliding can make significant contributions to in service performance. Single crystal and bi-crystal micro-compression pillars were machined from a large grained commercially pure Sn polycrystal using a focused ion beam. For the bi-crystals the grain boundaries were oriented at 45░ to the compression axis. Multiple pillars of different widths from 5 Ám to 0.5 Ám wide were tested. The boundary sliding deformation was more obvious for smaller sample cross-sections and made a larger contribution to the overall deformation. There was a significant size effect in which the resistance to grain boundary sliding increased as the sample size was reduced, however, the size effect for dislocation mediated plasticity in the single crystals showed are more marked strength increase encouraging the transition to grain boundary sliding at smaller length scales.