|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Analysis for Formation of Kirkendall Voids during Solid-state Annealing in the Cu/Sn System
||Minho O, Masanori Kajihara
|On-Site Speaker (Planned)
The Cu/Sn system is one of the most common metallurgical options for microbump joint. During annealing even at low solid-state temperatures, however, intermetallic compounds of Cu3Sn and Cu6Sn5 are produced at the interconnection between Cu and Sn. Furthermore, voids can be formed at the interconnection by Kirkendall effect. The formation of intermetallic compounds and Kirkendall voids deteriorates the mechanical and electrical properties of the interconnection. In the Cu/Sn system, the diffusion of Cu into Sn occurs much faster than that of Sn into Cu. The difference between the diffusion rates of Cu and Sn results in formation of atomic vacancies on the Cu side due to Kirkendall effect. These atomic vacancies aggregate to form Kirkendall voids at the interconnection. In the present study, the formation of Kirkendall voids during solid-state annealing was quantitatively analyzed using a diffusion model.
||Planned: A print-only volume