About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
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Symposium
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Additive Manufacturing: Equipment, Instrumentation and In-Situ Process Monitoring
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Presentation Title |
Instrumenting an EOS M290 with a Smart Build-Plate |
Author(s) |
Adam J. Hehr, Mark Norfolk, Ben Stefanko, Jason Riley, Megan Bax, Plamen Petkov, Ryan Zvanut, Tristan Cullom |
On-Site Speaker (Planned) |
Ben Stefanko |
Abstract Scope |
Ultrasonic Additive Manufacturing (UAM), a 3D metal printing technology, uses ultrasonic energy to produce metallurgical bonds between layers of metal foils near room temperature. This low temperature attribute of the process enables integration of temperature sensitive components, such as thermocouples, directly into metal structures for thermal event monitoring. In this study, a grid of thermocouples was built into an EOS M290 SS316 build-plate to monitor temperatures during a print job. High temperature tri-axial accelerometers were mounted to the underside of the build-platform to measure vibration events in parallel with thermal profiles, e.g., recoater strike. Both thermal and vibration data was sampled during a M290 print to quantitatively monitor the build process. A future outlook on the technology and its applications is described. |