|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Non-equilibrium Features of Grain Boundaries
||Unraveling Anti-thermal Behavior in a Variety of FCC Metals
||Ian Chesser, Yutong Bi, Elizabeth Holm
|On-Site Speaker (Planned)
In most solid polycrystalline materials the rate of atomic motion increases exponentially with increasing temperature, which severely limits the use of materials at high temperatures. Experiments and simulations reveal that in certain cases, atomic processes slow down as the temperature increases, which we call anti-thermal behavior. We demonstrate via synthetic driving force molecular dynamics simulations the importance of stacking fault energy in the mobility type of Σ 3 boundaries in FCC metals. Σ 3 grain boundaries with equivalent macroscopic geometries are shown to have different mobility dependence on temperature for different FCC metals. Motion mechanisms and transitions between mobility type are examined mechanistically for a range of FCC metals.
||Planned: Supplemental Proceedings volume