|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Calorimetric Investigation of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Additions
||Andriy Yakymovych, George Kaptay, Ali Roshanghias, Hans Flandorfer, Herbert Ipser
|On-Site Speaker (Planned)
Nowadays, lead-free Sn-Ag-Cu solders are widely used in electronics industry. However, the extensive growth of brittle intermetallic layers and the higher melting temperature compared to traditional lead-containing solders are the main issues of lead-free soldering. One of the approaches to counteract intermetallic growth in the interface of solders and common metallic substrates is to reinforce the solder matrix with small amounts of additional elements such as Co, Ni or Fe. The purpose of the present work is to provide experimental enthalpies data on the addition of Co in bulk and nano-sized form to the liquid Sn-3.8Ag-0.7Cu alloy using drop calorimetry. From this the integral and partial enthalpies of mixing for the quaternary Ag-Co-Cu-Sn system and the surface enthalpy of Co nanoparticles are estimated.
||Planned: A print-only volume