|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
||Fu Guo, Yu Tian, Yan Wang, Yishu Wang, Limin Ma
|On-Site Speaker (Planned)
The evolution of intermetallic compounds (IMC) in various composite and non-composite Sn-based solder joints was investigated under high current density. It was found that the IMCs in the Sn3.0Ag0.5Cu (SAC305) and Cu-reinforced Sn3.5Ag composite solder matrix were formed along both electron flow direction and c-axis direction of Sn. However, the Au(Sn0.83, In0.17)4 generated in Sn3.0Ag3.0Bi3.0In (SABI333) solder matrix were transformed from needle-like into small pieces of Au(Sn0.23, In0.77)2 under current stressing. Preliminary consideration of such differences could be contributed to the different diffusion rate and opposite migration direction of Sn and In atoms. The current study also compared the electromigration induced damages from IMC evolutions in different alloys based on their dependences on crystal orientation and alloying elements, suggesting possible approaches for mitigating electromigration from alloy design and microstructural engineering perspectives.
||Definite: At-meeting proceedings