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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Author(s) Fu Guo, Yu Tian, Yan Wang, Yishu Wang, Limin Ma
On-Site Speaker (Planned) Fu Guo
Abstract Scope The evolution of intermetallic compounds (IMC) in various composite and non-composite Sn-based solder joints was investigated under high current density. It was found that the IMCs in the Sn3.0Ag0.5Cu (SAC305) and Cu-reinforced Sn3.5Ag composite solder matrix were formed along both electron flow direction and c-axis direction of Sn. However, the Au(Sn0.83, In0.17)4 generated in Sn3.0Ag3.0Bi3.0In (SABI333) solder matrix were transformed from needle-like into small pieces of Au(Sn0.23, In0.77)2 under current stressing. Preliminary consideration of such differences could be contributed to the different diffusion rate and opposite migration direction of Sn and In atoms. The current study also compared the electromigration induced damages from IMC evolutions in different alloys based on their dependences on crystal orientation and alloying elements, suggesting possible approaches for mitigating electromigration from alloy design and microstructural engineering perspectives.
Proceedings Inclusion? Definite: At-meeting proceedings


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Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Fabrication of Stress Free Ni-Co Coatings Using Electroplating Method
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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