(Co,Mn)304 spinel coatings have shown exceptional electrical conductivity, effective Cr-blocking capability, good thermal and chemical stability, and adequate match in coefficient of thermal expansion to cell components. These benefits imply that (Co,Mn)3O4 might be a potential material for SOFC cathode-side contact application. In this research, (Co,Mn)3O4 spinels with different Co and Mn ratios were explored as the cathode-interconnect contact layer. The microstructure and performance of the spinel contact layer were characterized using scanning electron microscopy, X-ray diffraction, area specific resistance for optimizing the ratio of Co and Mn. Moreover, perovskites, like LSM, LSCF or LSCM which have an advantage of absorbing Cr, were added to the (Co,Mn)3O4 spinel to form a composite contact layer. The percentage of perovskite in the composite was varied to achieve the overall best performance.