| About this Abstract |
| Meeting |
Materials Science & Technology 2011
|
| Symposium
|
Fatigue and Microstructure: A Symposium on Recent Advances
|
| Presentation Title |
A 3-D Quantitative Crystallographic Model for Short Fatigue Crack Propagation through Grain Boundaries in High Strength Al Alloys |
| Author(s) |
Wei Wen, Tongguang Zhai |
| On-Site Speaker (Planned) |
Wei Wen |
| Abstract Scope |
A 3-D model for short fatigue crack propagation through grain boundaries was developed, based on the early discovery that the twist component of crack plane deflection across a grain boundary was the key factors controlling the crack growth in high strength Al alloys. The resistance of a grain boundary to crack growth was assumed to be a function of the twist angle of crack plane deflection at the boundary, and it was also contributed from the neighboring grain boundaries. By taking into both the driving force and the resistance, the growth rate of a short crack was calculated at each grain boundary along the crack front. This model was used to calculate the growth behaviors of a short fatigue crack in 3-D in an Al-Li 8090 alloy. The obtained results were consistent with the experimentally measured ones in the alloy. |
| Proceedings Inclusion? |
Definite: A CD-only volume |