|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||Inter-diffusion at Ag/Cu Interface
||Erh-Ju Lin, Cheng-Yi Liu
|On-Site Speaker (Planned)
Generally, Ag finish layer on Cu substrate is important in IC and LED package industry due to its high reflectivity. However, Cu atoms diffusing through the Ag layer from the Cu substrate is a critical issue for the reliability of the electronic package. As Cu atoms diffuse into the Ag surface, the Cu atoms react with oxygen to form Cu oxides, which would greatly degrade the solderability, reflectivity, and bondability of the Ag finish layer. Thus, the Cu diffusion through the Ag layer is a critical issue for the reliability of electronic package. In this talk, we will present experimental results on interdiffusion between the Ag finish layer and the four Cu substrates with different (1) prefer-orientations (2) grain size (3) surface roughness.
||Planned: Supplemental Proceedings volume