|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Physico-mechanical Properties and Microstructure of Sn3.0Ag0.5Cu Solder Ribbons Doped with Ni and Ni-Sn Nanoparticles
||Andriy Yakymovych, Peter Svec Sr., Pavel Sebo, Martin Nosko, Herbert Ipser
|On-Site Speaker (Planned)
The Ni and Ni-Sn nanoparticles were synthesized using a chemical reduction method. The morphology and particle size of the as-synthesized nanopowders were analyzed using transmission electron microscopy (TEM). The nano-composite solder alloys were prepared by mechanical mixing of Sn3.0Ag0.5Cu powder with nano Ni and Ni-Sn powders, while ribbons were fabricated using the conventional planar flow casting method. The electrical resistivity of doped (Sn3.0Ag0.5Cu)100 x(nanoNi)x and (Sn3.0Ag0.5Cu)100-x(nanoNi-Sn)x ribbons was measured by the standard four-points method. Furthermore, scanning electron microscopy was used to characterize the microstructure and morphology of intermetallic compounds at the interface solder/Cu. Afterwards, the shear strength and microhardness of the solder joints were investigated. It could be shown that nanosized additions led to minor changes in the electrical resistivity of Sn3.0Ag0.5Cu solder ribbons, while the minor Ni and Ni-Sn nanoinclusions resulted in a reinforced microstructure accompanied by an enhancement of the shear strength and microhardness of the solder joints.
||Planned: Supplemental Proceedings volume