|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Fracture Properties and Residual Stresses in Small Dimensions
||Temperature-Dependent Delamination Failure of Metal-Ceramic Interfaces
||Rafael Soler, Sriram Venkatesan, Johannes Zechner, Michael Nelhiebel, Roman Roth, Josef Fugger, Gerhard Dehm
|On-Site Speaker (Planned)
Delamination failure in modern microelectronic devices, where complex multi-layered structures are common, is known to be usually driven by thermal expansion mismatch stresses, both produced during the thin film fabrication process and during device operation (where multiple loading condition, e.g. temporal and spatial temperature gradients, are induced). In this work we shed some light on the delamination behavior of such complex structures under service temperatures, i.e. up to 400 °C. We analyse the temperature dependency on the interface strength of bimaterial interfaces. The study focuses on various metal-ceramic interfaces, namely between a metallization layer (W, Ti, or Cu) and a borophosphosilicate glass (BPSG). The mechanical experiments are conducted by both, macro- and micro-scale approaches, i.e. 4-point-bending and single beam cantilever experiments, respectively. The temperature-dependent delamination behavior will be discussed with respect to the microstructural and chemical evolution from pre- and post-mortem samples.