|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Nano Solder Interconnections by Low Temperature Soldering of Cu6Sn5
||Ying Zhong, Sungho Jin, Chunqing Wang
|On-Site Speaker (Planned)
Modern electronic packaging with smaller size solder bonding for higher device density increases the burden of having to carry significantly larger current density. In order to enhance the resistance to the electromigration/thermomigration and fatigue failures in Pb-free solders, mechanically and thermally more stable solder materials are desirable. We report on a novel concept of utilizing nanosized Cu6Sn5 intermetallics as low-temperature solderble interconnects. By utilizing 10 nm size regime nanoparticles of Cu6Sn5 intermetallics with nano-induced suppressed melting point, a solder bonding at ~200oC was successfully accomplished. A Pb-free solder bonding using such intermetallics having 415oC melting temperature can be beneficial for reduced electromigration/thermomigration during service. Microstructural analysis indicates a ductile dimple type fracture upon mechanical deformation, indicating an improved fracture toughness via nanograined microstructure. Effects of various materials parameters and processing variables on solder synthesis, structure as well as mechanical, thermal and electrical properties will be discussed.
||Planned: Supplemental Proceedings volume