|About this Abstract
||Materials Science & Technology 2019
||Late News Poster Session
||P2-92: Copper Particle Size Effect on the Microstructure and Mechanical Properties of Copper-based Transient Liquid Phase Sintering
||Khairi Faiz Muhammad, Yoshida Makoto
|On-Site Speaker (Planned)
||Khairi Faiz Muhammad
Low temperature bonding in power electronics module is desired to suppress the warpage due to coefficient of thermal expansion mismatch between constituent components in the module. Meanwhile, wide band gap future generation module for electric vehicle is expected to operate at temperature higher than 200°C, thus hinder the use of conventional low temperature solder. Transient liquid phase sintering of nano-scale copper particles mixed with tin-bismuth alloy powders has been investigated as a candidate to realize low temperature bonding that is also able to sustain high temperature operation. Since nano-scale copper particle is easily oxidized and high in cost, micro-scale copper particle is anticipated to overcome these issues. This study is the first to investigate and compare the influence of copper particle size on the microstructure and shear strength of transient liquid phase sintering of copper mixed with tin-bismuth eutectic alloy.