|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Theoretical and Experimental Study of Intermetallic Compound Grown by Electromigration, Thermomigration and Chemical Diffusion for Sn-0.7Cu Solders
||Sung-Min Baek, Min-Hyeok Heo, Namhyun Kang, Cheolmin Oh
|On-Site Speaker (Planned)
The high current density at μ-BGA in POP structure raises serious concern such as open-circuit failure because electromigration caused by the high current density accelerates kirkendall void and intermetallic compound (IMC) growth at solder bump joint. This study investigated the IMC growth kinetics modeled by electromigration (EM), thermomigration (TM), and chemical diffusion (CHE) for Sn-0.7Cu solders. The specimen had a constant thickness and transferred the electrons/atoms in vertical way to the boundaries of Cu-solder-Cu specimen. Thus, the effect of current crowding on the joule heating and IMC growth were minimized to influence TM effects on IMC growth. The modeling results showed a good agreement with the observed kinetics of the IMC growth. The effect of CHE was insignificant on the intermetallic compound growth specifically for current density 10 kA/cm2. Modeling of TM should reflect the CHE effect on the IMC growth.
||Planned: Supplemental Proceedings volume