| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Fatigue-Creep Interaction Damage Theory Based Thermal Fatigue Life Prediction Model for SnAgCu Solder Joints |
| Author(s) |
Yan Yong Chang, Li xiao yan, Liu na |
| On-Site Speaker (Planned) |
Li xiao yan |
| Abstract Scope |
SnAgCu solder is fast becoming a reality in electronic manufacturing
during to marketing and legislative pressure. This paper studies thermal fatigue life prediction model for SnAgCu solder on basis of classic continuous damage mechanism (CDM). In order to imitate the service condition of chip, the single point model coupling temperature and creep is adopted. The value of resistance is defined as the damage variable. As the value of stress or strain is difficult to be measured, FEM is applied to calculate the value of stress and strain. Then the constant in damage model is fitted by the experiment data. Base on the damage evolution equation, the life of solder joint is calculated and the result is compared to actual life of solder joint. It can be seen that difference between the prediction life and tests is no more than 10.2%. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |