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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
Author(s) De-Yu Tseng, Wei-Jhen Chen, Ti-Yuan Wu, Ming-Tzer Lin
On-Site Speaker (Planned) Ming-Tzer Lin
Abstract Scope In this study, the investigation of electromigration defects due to temperature and currents stress effects between solder/copper and solder/silver substrate were performed. Experiments were tested during heating (100℃, 150℃ and 200℃) ; heating and applied current (0.008A, 0.08A and 0.8A). We observed micro-structural changes, resistivity changes and intermetallic compound (IMC) formation. The results show that IMC thickness increases with increasing heating time and current stress in all different tested temperature. The percentage increase in the resistivity changes linearly, as the temperature increases the slope increases, resistivity change with the film micro-structural changes are closely related. The void formation and eletromigration defects were severely in Ag/Sn IMC than in Cu/Sn IMC under identical tested condition. Detail IMC growth mechanism and defect formation were closely study and discussed.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
Alloy Phase Stability under Electric Currents
Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">K-13: Interfacial ReactiK-13: Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys
[Replication or Save Conflict]
K-14: Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
K-15: The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria and Thermodynamic Assessment of the Mo-Nb-Re Ternary System
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Sinter Joining and Wiring without Pressure Assist for GaN Power Device Interconnection
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells

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