|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
||The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
||De-Yu Tseng, Wei-Jhen Chen, Ti-Yuan Wu, Ming-Tzer Lin
|On-Site Speaker (Planned)
In this study, the investigation of electromigration defects due to temperature and currents stress effects between solder/copper and solder/silver substrate were performed. Experiments were tested during heating (100℃, 150℃ and 200℃) ; heating and applied current (0.008A, 0.08A and 0.8A). We observed micro-structural changes, resistivity changes and intermetallic compound (IMC) formation. The results show that IMC thickness increases with increasing heating time and current stress in all different tested temperature. The percentage increase in the resistivity changes linearly, as the temperature increases the slope increases, resistivity change with the film micro-structural changes are closely related. The void formation and eletromigration defects were severely in Ag/Sn IMC than in Cu/Sn IMC under identical tested condition. Detail IMC growth mechanism and defect formation were closely study and discussed.
||Planned: Supplemental Proceedings volume