|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Characterization of Minerals, Metals, and Materials
||Effect of Alloying Elements on Diffusing Bonding Parameters in Al6063 Alloy
||Sıla Ece Atabay, Arcan Fehmi Dericioglu
|On-Site Speaker (Planned)
||Sıla Ece Atabay
During diffusion bonding, high temperatures involved in the process cause grain growth deteriorating the mechanical properties of the base metal. To overcome this problem process time could be shortened by increasing the kinetics of the bonding or grain growth could be prevented by segregation of new complexes at the grain boundaries.
In this study, DB parameters were optimized for Al6063 alloy. To prevent grain growth without altering the composition Gold and Nickel were used as interlayer materials to shorten bonding time. However, interlayer addition showed a decreasing trend in bond strength. In this respect, Xx(X: Sn, Cu and x:0.5-5wt%) was added to the alloy to see the effect of these elements on grain growth and bond strength. Effects of these treatments were characterized via combined study of optical microscope, SEM, EDS and XRD. Mechanical properties of the joints are determined via shear testing, and results were discussed in detail.
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