|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Low Temperature Bonding Material with Submicron Copper Particles
||Kei Anai, Shinichi Yamauchi, Takahiko Sakaue, Yoichi Kamikoriyama, Katsuaki Suganuma
|On-Site Speaker (Planned)
Silver nanoparticles are widely studied as a bonding material for power devices, but they have some concerns such as anti-migration property, high cost, handling property, safety and etc. In order to address above problems, we newly developed submicron copper particles of low temperature sinterability and prepared copper ink to apply as a bonding material to a copper substrate. The copper ink using submicron copper particles can be sintered at 260 °C for 3 min in nitrogen atmosphere. It is confirmed by the cross-sectional observation of the sintered body that the copper particles and the copper substrate forms a tight continuous phase, which also shows high shear strength. These results indicate that the developed copper ink can be applied as an excellent bonding materials for high power devices.
||Planned: Supplemental Proceedings volume