A Quantitative Assessment of Microstructural Coarsening of SnAgCu Solders: Effect of Metallization and Thermo-mechanical History

Accelerated Life Prediction of Electrochemical Ion Migration on ENIG Surface Finish Circuit

Analysis of Simple Shear of Lead-Free Solder Joints to Examine Heterogeneous Strain and Slip System Activity

Back-Stress Induced Single Crystal Hillock Growth in Unpassivated and Nanotwinned Copper Lines under Electromigration at Device Operation Temperature

Bending and Strain/Stress Distribution on Flip Chips Measured by Using Synchrotron X-Ray Laue Microdiffraction

Characterization of Metal Whisker Growth in Sn-Based Solders

Comparison of Solder Joint Nucleation Control and Reflow Microstructures in Sn-Cu and Sn-Ag-Cu with Minor Additions

Corrosion Enhanced Sn Whisker Growth

Creep Property of Sn-3Ag-0.5Cu-xNi/Au/Ni Joints after Aging

Critical Conditions of Electromigration-Induced Cu Dissolution in Pb-Free Solder Joints

Critical Current Density of Inhibiting the (Cu,Ni)6Sn5 Formation in the Ni-side of Cu/Solder/Ni Joints

Cross-Interaction between Ni and Cu across a High-Lead Solder Joint with Different Solder Volume

Current Stressing Effect on Intermetallic Compound Growth kinetics in Cu Pillar/Sn Bump

Development of Sn-Ag-Cu-X Alloys For Electronic Assembly

Direct Measurement of Back Stress Un Tin Strips under Electromigration by Synchrotron Radiation X-ray

Discussion on the Mechanism of Electromigration Form the Perspective of Electromagnetism

Effect of Ag on the Kirkendall Void Formation in Sn-Ag/Cu Solder Joints

Effect of Initial Microstructure on Electromigration behavior of Eutectic Sn-Pb Solder Joints

Effect of Joule Heating on Thermo-Electromigration Induced Failure in Lead-Free Solder

Effect of Minor Alloying on the Performance of Snagcu Solder Joints under Ball Impact Test

Effect of Pb Addition on Creep and Tensile Behavior of SAC 305 Solder

Effect of Zn-containing Flux on the Joint Strength and Microstructure of Sn-3.5Ag Soldering on an Electroless Ni-Au Surface Finish

Effects of Co Addition upon Sn-8.8Zn/Cu and Sn-57Bi/Cu Interfacial Reactions

Effects of Current Density on the Crystallographic Texture of Sn based Electrodeposited Films Containing Cu and Pb

Effects of Minor Ni Doping on Interfacial Reaction and Microstructure Variation in the Cu/Sn-3Ag-0.5Cu-xNi/Au/Ni Sandwich Structure

Effects of POSS on Impact Behavior of Thermomechanically Fatigued Lead-Free Solder Joints

Effects of processing and amount of Co addition on shear strength and microstructural development in Sn-3.0Ag-0.5Cu solder joint

Effects of Reinforcements Addition on Microstructural Evolution in Eutectic SnBi Solder Joints under Current Stressing

Electrochemical Corrosion Behavior of HighTemperature Pb-free Solders

Electromigration Study of Flip Chip Packages under Extra-high Current Density Tests with Temperature Control

Fatigue-Creep Interaction Damage Theory Based Thermal Fatigue Life Prediction Model for SnAgCu Solder Joints

Formation and Growth of Intermetallic Compound (Cu6Sn5) at Early Stages in Lead-Free Soldering

High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

Impact of Isothermal Aging on Long Term Reliability of Fine Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects

Impact Testing of Sn3.0Ag0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization after Aging at 150 C

Impression Creep of Pb

Improved Reliability of Sn-Ag-Cu-In Solder Joint by the Addition of Trace Elements

Improvement of Heat Dissipation in High-Power Light-Emitting Diodes Using Highly Heat Conductive Die-Attach Material

Improvement of Wettability and Thermal Properties at Bi Based Alloys

Influence of Interface Reaction on Out–of–Plane Displacements During Thermal Cycling of Copper–Silicon Bond with an Indium Interlayer

Interaction between Electromigration and Diffusionally Accommodated Interfacial Sliding at Hetero-Interfaces

Interface Design of Lead-free Electronic Interconnects

Interfacial Reaction and Joint Reliability of Electrodes Bonded with Transverse Ultrasonic

Interfacial Reaction and Microstructure Variation in the Liquid Reaction of Sn-xAg-Cu Solders on Cu-yZn Substrates

Interfacial Reaction between Sn-Ag-Cu Solder and Cu Base Metal Using Laser Soldering Process

Interfacial Reactions Between Near Eutectic Snagcu Solder Alloys and Electrolytic Au/Ni Substrates

Interfacial Reactions of Cu/Sn3.5Ag/Au Solder Joint under Electromigration

Interfacial Reactions of Sn3.0Ag0.5Cu Solder with Cu-Mn UBM during Aging

Intermetallic Compounds and Mechanical Properties of Sn-3Ag-0.5Cu and Sn-1Ag-0.5Cu-0.06Ni-0.01Ge Solder Ball Grid Array Packages with ENIG Surface Finish

Internal Strain Evolution during Thermal Cycling in a Row of Lead-Free Solder Joints in a Flip Chip Ball Grid Array Package

Investigating Defects in Through-Silicon via (TSV) Chains by Three Dimensional Imaging Reconstruction

Investigation and Effects of Wafer Bow in Different 3D Stacking Schemes

Joint Strength Enhancement by CNT Inserted Sn3.5Ag Solder Balls

Kinetics of Intermetallic Compound Formation at the Interface between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrate

Liquid Phase Sintered Solders as Thermal Interface Materials for Conventional and High Temperature Electronic Applications

Local Mechanical Properties of Cu6Sn5 Intermetallics in Pb-Free Solder Joints by Microcompression Testing of Pillars

Mechanical Properties of Interfacial IMCs in Solder Joints Evaluated by Nanoindentation

Mechanical Shock of Environmentally-Benign Pb-Free Solders

Mechanism of Microstructure Evolution and Fatigue Failure in Lead Free Solder Joint

Microstructure and Orientation Evolution Study on Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Arrays Using Orientation Image Microscopy

Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface between Sn-Cu Solders and Cu Substrate Due to Minor Additions of Alloying Elements

Microstructures and Crystal Orientation of β-Sn for Sn-Ag and Sn-Cu Solder Joints under Electromigration

Microvoid Formation at Solder-Copper Interfaces during Annealing: A Systematic Study of the Root Cause

Mitigation of the Growth of Tin Whiskers by Surface Treatments

Modeling of Pb-Free BGA Solder Joint Fatigue Life during Random Vibration

Modeling of Reflow Temperatures and Wettability in Lead-free Solder Alloys using Hybrid Evolutionary Algorithms

Nucleation and Solidification of Sn in Pb Free, SnAgCu Solder Joints

Observations of IMC Formation for Au Wire Bonds to Al Pads

On the Mechanism of Retarding Cu3Sn Growth by Ni Addition

On The Merits of Transient Liquid Phase Bonding as a Substitute for Soldering with High-Pb Alloys

Optimization of Solutions to Electrodeposit Sn-Based Pb-Free Solders

Orientation Imaging Studies of Sn3.0Ag0.5Cu Solder Joint with Various Ni Doping after Aging

Pb-free Process Development for Microcircuit Package Assemblies – A University/Industry Design Project Collaboration

Polycrystalline Sn Whisker Growth

Polymers Investigation for 3D IC Stacking Technology

Reaction between Sn and Electroplated Cu Foils with Different Orientation

Real-Time SEM/FIB Studies of Whisker Growth and Surface Modification

Reliability Evaluation of Cu-Cored Solder Joints

Roles of Service and Materials Parameters on Reliability of Pb-free, Sn-based, Solder Joints

Shear and Bending Fatigue Failure of Lead Free Solder Joint and Fracture Mechanics

Shock Resistant And Thermally Reliable Low Ag SAC Solders Doped With Mn Or Ce

Sn Whiskers and Grain Boundary Sliding

Solidification of the Sn-Cu-Ag Eutectic Alloy

Space: The Final Frontier for Pb-Free Electronics?

Study of Emerging New Interconnect Methods: How Far SMT Will Go

Study of Joule Heating Effects in Lead-Free Solder Joints under Various Current Densities Using Infrared Thermography

Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests

Study of UBM Consumption in Flip Chip Solder Joints with Local Temperature Control

Study on Paste Printing for Electronics

Synchrotron Microdiffraction Study of Localized Stress and Surface Evolution in Sn-Cu System

TEM Characterization of the Porous Structure Induced by High Current Density in the Flip-Chip Solder Joint

The Effect of Temperature on the Critical Cu Concentration in SnCu/Ni Reaction

The Enhanced Growth of Sn Whisker on High Melting Temperature Sn-Pb Solder Joint by Current Stressing

The Fracture Behavior of Aged Sn-Ag-Cu Solder Joints During High-Strain Rate Loading

The Interaction between Imposed Current and Creep of Idealized Snagcu Solder Interconnects

The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu

Thermal and Electrical Evaluation of GaAs Flip-Chip after Thermal Reliability Test

Thermal, Mechanical Stability, and Wetting Behavior of Novel Cerium (Ce)-Containing Pb-free Solders on Cu and Ni-Au Metallization

Thermomigration and Creep in Pb-Free Flip Chip Solder Joints

Uncovering the Driving Force for Massive Spalling

Wafer Bonding Using an Amorphous Si-Au Eutectic Structure

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