|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Advanced Composite Materials for Passive Thermal Management of Electronics
||John A. Howarter, Yash Ganatra, Alexandra Bruce, Amy Marconnet
|On-Site Speaker (Planned)
||John A. Howarter
Polymer composites are used in a diverse set of applications such as aerospace, electronics, and packaging due to their ease of manufacturing, low cost, and highly tunable range of properties. In the electronics field, there is a large demand for polymer composites with high electrical resistivity and good thermal conductivity for use as substrates for passive thermal management. Achieving this goal will allow for more efficient energy use as it will reduce the need for active cooling processes. Here we designed highly oriented nanocomposites of boron nitride embedded in a polymer matrix. The interface between boron nitride and the polymer matrix was varied with a range of small molecule compatiblizers. Impact of particle distribution and surface modification was correlated to thermal performance. Critical thermophysical properties include the thermal conductivity, heat capacity, and latent heat of any phase/state change for the polymer matrix.
||Planned: Stand-alone book in which only your symposium’s papers would appear (indicate title in comments section below)