|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Computational Design and Simulation of Materials (CDSM 2018): Meso/Macroscale Simulations
||From Process to Performance: A Scale Bridging Numerical Framework for Addressing Joint Formation and Electromigration in Cu/Sn/Cu Interconnections
||Vahid Attari, Thien Doung, Raymundo Arroyave, Zachary Morgan, Yongmei Jin
|On-Site Speaker (Planned)
The path to establish/expand scale bridging numerical frameworks in the advanced materials design projects is the inevitable. A "mesoscale" framework is developed to address the formation and growth of intermetallics (micro-joint formation), and further evaluation of the performance of the Cu/Sn/Cu system during electromigration circumstances. The Framework encompasses the thermodynamics (CALPHAD), the kinetics (Phase Field Model) of the reacting system, coupled with the charge continuity, and vacancy transport to address the various aspects of microstructure evolution. Vacancy model is also coupled with the Density Functional Theory (DFT) to address the vacancy transport in the intermetallic layers. The Phase field module addresses the independent behavior of the intermetallic layers during electromigration. The results infer faster growth of the intermetallics at the anode and shrinkage at the cathode. The equilibrium point defect concentration in the intermetallics and solute site preferences are also calculated and the vacancy accumulation in the cathode is addressed.
||Planned: Supplemental Proceedings volume